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Home> Service> Wet Processes for Metallization
Al2O3,AlN Metallization
Al2O3, AlN Metallization for 3D LED
1.Surface metallization:
Feature:
Surface metallization of Al2O3 and AlN substrates using electroless Cu
deposition and Cu electroplating.
After thermal treatment, no Cu blister and
peeling.
Peeling strength of the plated Cu layer is 0.2 kgf/cm.
2.Hole filling by Cu plating
Feature:
  • Enhance heat dissipation of LED.
  • Through hole filling by Cu plating can construct 3D LED packaging to increase LED illumination.
  • Void-free through-hole Cu filling enhance reliability of 3D LED.
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