這個頁面上的內容需要較新版本的 Adobe Flash Player。

取得 Adobe Flash Player

Home> Service> Wet Processes for Metallization
Through-Silicon Hole (TSH) Filling
Through-Silicon Hole (TSH) Filling
1.Through-Silicon Hole (TSH) Filling
Feature:
  • Decreasing the loading of CMP.
  • TSH can be filled in H-type or in BFT.
  • Filling performance can reach AR from 2.5 ~ 10.

H-type TSH filling

AR: 6 H = 320μm,D = 50
Phase I: using H-type filling formula Phase II: using bottom-up filling formula
HomeIntroNewsServicesAlbumDownloadContact Us
All images and content of this website reference the information required for the present system,
Disclaimer National Chung Hsing University Department of Chemical Engineering ESC.
Tel:886-4-22840510 ext. 905 Fax:886-4-22854734  e-mailMail
Address:402 No.250, Guoguang Rd., South Dist., Taichung City 402, Taiwan (R.O.C.)「工程三館-化工暨材料大樓」  Website Design:ChingMei