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Home> Service> Wet Processes for Metallization
Wet Processes for Metallization
Development of novel Cu nanoparticles (CuNPs) catalyst
The TEM image of CuNPs to replace Pd catalyst for electroless deposition (ELD) The particle size distribution of CuNPs
Lifetime test of CuNPs for ELD Cu on PCB (Cu deposition rate and
UV absorption)
The CuNPs have a long stable lifetime
   
CoWP layer has an excellent thermal stability and barrier property
at a high temperature, resulting in a low probability of void
formation after electroplating to enhance the reliability of 2.5D, 3D packaging products.
The FE-SEM cross section of TSV with CoWP barrier layer and ELD Cu seed layer. The image of a full wafer after ELD Cu.
Using CuNPs as cataysts to replace Pd catalyst for ELD Cu seed
layer deposition on CoWP barrier layer for saving process cost.
The all wet process result:
Fully filling TSV with electroplating Cu after CoWP barrier and ELD Cu seed
layer catalyzed by CuNPs.
The OM image of TSV after Cu electroplating The FIB image of TSV after Cu electroplating
The ELD Cu on PCB by using CuNP catalyst

The back light images of through-hole of PCB after ELD Cu by using CuNP catalyst

The SEM images of through-hole of PCB after ELD Cu by using CuNP catalyst. (on glass fiber; on resin)

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